| Standard Features | Standard | Advanced |
|---|---|---|
| Maximum Layer Count | 16 | 24 |
| Maximum Panel Size | 18”x24” | 21”x26” |
| Outer Layer Trace/Spacing | .005” / .005” | .003” / .003” |
| Inner Layer Trace/Spacing | .005” / .005” | .003” / .003” |
| Maximum PCB Thickness | 0.250” | 0.250” |
| Minimum PCB Thickness | .008” | .004” |
| Minimum Mechanical Drill Size | .008” | .004” |
| Maximum PCB Aspect Ratio | 10:1 | 20:1 |
| Maximum Copper Weight | 6oz | 16oz |
| Minimum Copper Weight | 1/2oz | 1/4oz |
| Minimum Core Thickness | 0.004” | 0.0015” |
| Minimum Dielectric Thickness | 0.003” | 0.002” |
| Minimum Pad Size Over Drill | 0.018” | 0.016” |
| Solder Mask Registration | ± 0.002 | ± 0.0015 |
| Minimum Solder Mask Dam | 0.004” | 0.0025” |
| Copper Feature to PCB edge | 0.015” | 0.010” |
| Tolerance on Overall Dimensions | ± 0.005” | ± 0.002” |
| HDI Features | Standard | Advanced |
|---|---|---|
| Minimum Microvia Hole Size | 0.004” | 0.003” |
| Capture Pad Size | 0.010” | 0.009” |
| Glass Reinforced Dielectrics | Y | Y |
| Maximum Aspect Ratio | 0.7:1 | 1:1 |
| Stacked Microvias | Y | Y |
| Copper Filled Microvias | Y | Y |
| Buried Filled Vias | Y | Y |
| Maximum No. of Buidup Layers | 3+N+3 | 5+N+5 |
| PCB Technology | Standard | Advanced |
|---|---|---|
| Rigid-Flex & Flexible Circuits | Y | Y |
| Buried and Blind Vias | Y | Y |
| Sequential Lamination | Y | Y |
| Impedance Control | ± 10% | ± 5% |
| Hybrids & Mixed Dielectrics | Y | Y |
| Aluminum Backed PCB | Y | Y |
| Buried Capacitance | N | Y |
| PCB with Cavity | N | Y |
| Non-Conductive Via Fill (VIP) | Y | Y |
| Conductive Hole Fill | Y | Y |
| Depth Control Drill and Rout | Y | Y |
| Backdrill | Y | Y |
| Edge Plating | Y | Y |
| Etch Back | Y | Y |
| In-Board Beveling | Y | Y |
| 2-D Bar Code Printing | Y | Y |