HDI – High Density

Interconnect PCBs

Excello Circuits provides a complete range of services to our customers in PCB prototypes and PCB manufacturing, allowing them the freedom to have a one stop shop for their PCB requirements. Our product offerings include rigid PCBs, rigid flex PCBs and HDIs.

HDI PCBs feature high-density attributes such as microvias, buried vias, and blind vias. These features enable more complex interconnections and improved performance in advanced technology applications.

HDI PCBs have higher interconnect density per unit area requiring more sophisticated technology and manufacturing processes for their production. HDI PCBs are boards with high-density characteristics including micro-sized holes, fine lines and can be constructed with thin high performance materials, thereby enabling more interconnected functions per unit area.


HDI Structures


1+N+1 – PCBs contain 1 "build-up" of high-density interconnection layers.

i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in demanding designs.


Category Technical Specification
Number of Layers Single-sided to 32 layers
HDI Builds 1+N+1, 2+N+2, 3+N+3, 4+N+4, any layer / ELIC, Ultra HDI in R&D
Materials FR4, Rogers and many more
Copper Weight 0.5 - 4 oz. inner / 1 - 20 oz. outer
Minimum Track and Gap 1.2/1.2 mil
PCB Thickness 0.40mm – 3.20mm
Surface Finishes Available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold and many more
Minimum Mechanical Drill 0.15mm
Minimum Laser Drill 0.10mm standard, 0.075

For more detailed technical information and our capabilities, check our Technical Capabilities page.


Common Applications

Wireless
Telecom
Military
Medical
Semiconductor
Instrumentation

And many more