Category | Technical Specification |
---|---|
Number of layers | Single-sided to multi-layer |
Materials | Aluminium & copper plates. FR-4, PTFE, thermal dielectrics. |
Dielectric thickness | 0.05mm – 0.20mm |
Thermal conductivity | 1-12 W/m/K |
Profile method | Punching, Liquid cooled routing |
Copper Weight | 0.5 - 4 oz. Inner / 1 - 20 oz. Outer |
Trace/Space | Down to .003" |
Metal core thickness | 0.40mm – 3.20mm |
Surface finishes available | HASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver and many more |