Category |
Details |
Layer Count |
Single-sided to 24 layers
|
Hybrid Stack-Ups |
Hybrid stack-ups with PTFE and non-PTFE |
Surface Finishes |
ENIG, immersion tin, OSP and more |
Sequential Lamination |
Up to 4 cycles |
Aspect Ratio for Microvias |
0.75:1 |
Aspect Ratio for Through-Holes |
10:1 |
Minimum Hole Diameters |
5 mil for mechanical drill and 3.5 mil for laser drill |
Back Drilling |
Minimum 12-mil hole and +/-1 mil depth tolerance |
Tolerances |
+0.5 mil for laser routing and +/-3 mil for mechanical routing |
Gold Plating |
Selective and full-body hard and soft gold plating up to 120µ |
Additional Capabilities |
Countersink holes; Castellations; Cavities; Edge plating; Buried via / blind via / microvia; Gold fingers |